Travel Grants & Registration Discounts
We are pleased to announce the availability of Travel Grants & Registration Discounts to support attendance at SII 2026 in Cancun. These grants and discounts are made possible through the generous support of the IEEE Robotics and Automation Society (RAS), the IEEE Industrial Electronics Society (IES), and the Society of Instrument and Control Engineers (SICE).
Important: Applicants must apply to only one of the travel support programs listed below, depending on their membership affiliation. Submitting multiple applications will result in automatic disqualification. Applicants can now apply to multiple travel support programs!
IEEE IES Students & Young Professionals Paper Assistance Program (IES-SYPA)
The Student & Young Professionals (S&YP) Activity Committee of the Industrial Electronics Society (IES) offers financial support of up to 1,500 USD to IEEE IES S&YP members to attend IES conferences. Approved finalists of this program will be invited to join the SYP Forum, a special event aimed at helping students and young professional members stay connected in the IES community. The SYP Forum program will include two keynote speeches by young professionals, a winners' 3-minute Video Session, and an open discussion between the participants. We encourage all conference attendees to join this exciting event!
- Eligibility: Must be members of the IEEE IES, either Student, Graduate Student, or Young Professional (defined as within 15 years of graduation).
- Award amount: Up to 1,500 USD to be spent on hotel, transportation, or the registration fee itself.
- Expected number of awards: Up to 10 awards. Sponsored by IEEE IES.
- To apply:
- Please submit your application using the following online form: https://forms.gle/VCZhvKnCHw3bNLuAA
- Guidelines: guidelines-for-ies-sypa-application.pdf
- Important dates:
- IES-SYPA application submission deadline: Nov. 12, 2025.
- 1st-round general comments on the videos will be sent by Nov. 23, 2025.
- Submission of the final 3-minute video: Nov. 29, 2025.
- Announcement of winners: Dec. 5, 2025.
- Dedicated page: SYP Forum
IEEE RAS Member Support Program (MSP)
The IEEE RAS Member Support Program (MSP) offers registration discounts and travel support to active IEEE RAS members attending sponsored conferences. Discounts reduce fees for authors and workshop organizers, while travel support assists students and researchers from developing countries. Eligibility requires IEEE RAS membership and active participation in SII 2026. More information: https://www.ieee-ras.org/membership/member-support-program.
Important: There should be no more than one travel award or discount applied per paper or per author.
IEEE RAS Travel Support Program
- Eligibility:
- Must be members of IEEE RAS.
- Must be student authors (of accepted papers) or authors from developing countries (as determined by the IEEE in IAWP Developing Country Listing).
- Must be presenting work at SII 2026.
- Award amount: Up to 1,500 USD to be spent on hotel, transportation, or the registration fee itself.
- Expected number of awards: Up to 3 awards. Sponsored by IEEE RAS.
- To apply: Please submit your application using the following online form: https://forms.gle/mnbSdZ3RU6PcR8W98
- Important dates:
- Application submission deadline: Nov. 3, 2025.
- Announcement of winners: Nov. 10, 2025.
IEEE RAS Registration Discounts
- Eligibility:
- Must be members of IEEE RAS.
- Must be student authors (of accepted papers) or authors from developing countries (as determined by the IEEE in IAWP Developing Country Listing).
- Must be presenting work at SII 2026.
- Discount amount:
- 89 USD to the registration fee of authors of accepted papers.
- 89 USD to the registration fee of a workshop organizer.
- Expected number of discounts:
- 62 discounts to authors of accepted papers. Sponsored by IEEE RAS.
- 1 discount to a workshop organizer. Sponsored by IEEE RAS.
- To apply: Please submit your application using the following online form: https://forms.gle/UiCY1zvMAKZSZm3SA
- Important dates:
- Application submission deadline:
Nov. 3, 2025Dec. 7, 2025. - Announcement of winners:
Nov. 10, 2025Dec. 8, 2025. - Last day to use the discount: Dec. 10, 2025.
- Application submission deadline:
SICE International Young Authors (SIYA) Award
The Society for Instrument and Control Engineers (SICE) aims to be a leading society in the fields of measurement, control, and system integration, with a global presence. Specifically, its objectives are to strengthen collaboration with related organizations, support their globalization efforts, and foster young researchers who will lead the next generation in these fields. As part of this mission, we have established the SICE International Young Authors (SIYA) Award to encourage young researchers to pursue academic research and support their international activities. More information: https://sice-si.org/en/siya-sii2026-cfa/.
- Eligibility:
- Be 35 years old or younger as of Mar. 31, 2026.
- Have not received the SIYA Award at any past SII conferences.
- Be the first author of a contributed paper and present the paper at SII 2026.
- Hold or be in the process of obtaining SICE membership by the time of the award presentation at SII 2026.
- Award amount: Up to 100,000 JPY to be spent on hotel, transportation, or the registration fee itself.
- Expected number of awards: Up to 10 awards. Sponsored by SICE.
- To apply: Please submit your application and all necessary documents by email: M-siya-sii2026-ml@aist.go.jp
- Important dates:
- Application submission deadline: Dec. 12, 2025.
- Announcement of winners: (TBD)